Electrical Engineer – RF & IC Design

MoRF

About the company:

MoRF is a semiconductor startup developing next-generation tunable RF chiplets, leveraging a proprietary piezoelectric and ferroelectric material platform aimed at the next generation of front-end modules. Our chiplets are designed to reduce the footprint of RF systems by replacing bulky discrete components with compact, tunable, and highly integrated components. Backed by top-tier incubators and industry stakeholders, we are now building our founding engineering team.

Job description:

As a key member of our technical team, you will lead the design, simulation, and layout of integrated RF circuits, focusing on front-end components like filters, multiplexers, switches, phase shifters, and varactors. You will work closely with silicon processing FABs to turn our material innovation into functional chips, optimizing for performance, manufacturing, and system integration.
Responsibilities
● Full-cycle chip design: from schematic to layout to silicon validation
● Design and simulate CMOS-based RF circuits and passive components, including switches, multiplexers & filters (BAW/SAW)
● Interface with EDA tools for circuit and EM simulation (e.g., PrimeSim, Ansys Mechanical and HFSS)
● Integrate novel piezoelectric/ferroelectric materials into IC designs, collaborating with materials scientists and process engineers
● Drive physical layout and post-layout verification with attention to RF performance
● To perform device characterization and diagnostics using the latest RF/Microwave test equipment
● Collaborate closely with system architects, fabrication teams, and packaging partners
● To continuously improve design flow, cycle time, and schedule

Required qualifications:

● BSc or higher in Electrical Engineering or related field
● 5+ years of hands-on experience in RF IC design
● Creative, independent, with a strong technical background
● Comfortable working cross-functionally with materials scientists, process engineers, and external partners
● Proven track record in chip-level RF front-end design and productization
● Familiarity with BAW filter design and integration, or comparable filter technologies
● Strong background in simulation methodologies (EM, S-parameters, non-linear RF)
● Experience in post-layout validation, design-for-test (DFT), and lab measurement (VNA, spectrum analyzer, etc.)
● Deep understanding of the full IC development process, from spec to tape-out
Preferred Qualifications
● Experience with piezoelectric\ferroelectric materials or MEMS-based devices
● 5+ years direct experience in acoustic design (BAW or SAW), modeling or other advanced acoustic filter technology experience is required
● Knowledge of advanced packaging and RF interconnects
● Exposure to startup or early-stage development environments
● Familiarity with high-frequency FEM design for wireless applications (e.g., 5G, 6G Wi-Fi, mmWave)

Job location

Weizmann Institute (First 6 months), WFH, Tel Aviv